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Dorsavi Ltd (ASX:DVL)

ALERT: Price-sensitive ASX Announcement for DVL
Current share price for DVL : $0.024 -0.002 (-6%)+
Release
24 Aug 2026 8:48AM
Price at Release
$0.025
Full Release
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Summary
dorsaVi Limited announced the successful completion of the front-end-of-line and middle-of-line fabrication for its first RRAM-CMOS validation chip using TSMC's CMOS process. This achievement establishes a foundational CMOS platform for the company's proprietary back-end-of-line RRAM integration sequence, marking significant progress in their roadmap towards developing low-power Physical AI hardware. The milestone supports dorsaVi's efforts to address power and memory efficiency constraints in Physical AI systems such as robotics and autonomous vehicles. CEO Mathew Regan highlighted the importance of this milestone as a critical step toward integrating their proprietary RRAM technology.
Key Points
  • dorsaVi completed front-end-of-line (FEOL) transistor fabrication and middle-of-line (MOL) interconnects for its first RRAM-CMOS validation chip using TSMC's CMOS process.
  • The foundational CMOS platform is now ready for the company's proprietary back-end-of-line (BEOL) RRAM integration sequence.
  • This milestone aligns with dorsaVi's roadmap towards creating low-power Physical AI hardware.
  • dorsaVi's RRAM technology aims to support local processing for Physical AI applications including robotics, exoskeletons, autonomous systems, and more.
  • Mathew Regan, CEO of dorsaVi, expressed satisfaction with the progress, emphasizing the importance of the completed CMOS fabrication as a physical foundation for RRAM integration.
IMPORTANT NOTE: This information is autogenerated and has not been reviewed for accuracy or completeness. You should refer to the full announcement here for further information.